Bottom Side Selective Soldering Machine with Iron Head Technology an alternative or addition to selective mini-wave

Introduction
The most common THT soldering technology is the selective mini-wave.
The occurrence of high-mass joints is a growing trend.

Table of content
mta® - short introduction
Iron head technology versus mini-wave
What makes some joints problematic?
How does the iron solve these problems?
Aren’t irons slower?
Iron soldering head
Heating element
Solder wire feeder
Vision system
Bottom side selective soldering machine MPS700
Cartesian robot
Conveyor system
Indexing and clamping system
"Environment-friendly" production system
Iron head technology an alternative or addition to mini-wave

mta® – short introduction
mta® a brand of Unitechnologies SA
Leader in selective soldering & volumetric dispensing
50 years of automation experience
Process analysis in state-of-the-art test laboratories
More than 2’700 machines installed worldwide

Iron head technology versus mini-wave
High-mass joints need long exposure to the wave
Copper dissolves into molten solder
Copper layers can become dangerously thin
Mini-wave is not the best solution for high-mass joints.
What makes some joints problematic?

Iron head technology versus mini-wave
How does the iron solve these problems?
Individual soldering parameters
Pre-heat of each joint using a heating element
Solid solder wire melts on contact
With iron there is no copper dissolution.

Less effective on relatively small and similar mass joints
Short time to soldering temperature
Minimized energy fluctuations
Iron is normally faster with high-mass joints.
Iron head technology versus mini-wave
Aren’t irons slower?

Iron soldering head designed for bottom side point-to-point applications.
Iron soldering head

Heating element:
Individual soldering parameters for each point:
Pre-heating time
Soldering temperature
Post-heating time
Short time to soldering temperature
Accurate temperature control
Iron soldering head

Solder wire feeder:
Drives the solder alloy to the exact position
Checks the amount been dispensed
Quick and easy change of solder alloys
Iron soldering head

Vision system:
Points on PCB are automatically realigned
Identifies process points or fiducial marks
Sensor measures vertical position
Iron soldering head

Bottom side selective soldering machine MPS700
MPS700 an inline, bottom-side process that uses a robotic soldering iron.

Bottom side selective soldering machine MPS700
Cartesian robot:
4 axes cartesian robot
Can reach joints unreachable with fountains
Teaching using inspection camera

Bottom side selective soldering machine MPS700
Conveyor system:
Meets SMEMA standards
Easy integration into production lines
Adjustable wide from 50 to 700mm

Bottom side selective soldering machine MPS700
Indexing and clamping system:
Wide range of pallets/PCB`s
Locates boards
Accurately holds in position

“Environment-friendly” production system
MPS700 provides significant advantages:
Electrical consumption is much less compared to mini-wave
No need for nitrogen
Flux residues and dross are minimal
Very low maintenance

MPS700 is a complement to mini-wave soldering – not a replacement for it.
Both technologies combined:
Fountain can operate at its ideal temperature
MPS700 processes high-mass joints
Iron head technology an alternative or addition to mini-wave